Clemson University Announces Printed Electronics Initiatives
December 2007
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CLEMSON, S.C.—Clemson University will host a Printed Electronics Primer presentation and session on Jan. 22 from 3 - 5 p.m., for industry visitors that are new to the market opportunities and technologies of printed electronics. The university’s Printed Electronic initiatives are supported by the Sonoco Institute of Packaging Design and Graphics and Clemson faculty.
On Jan. 23, Clemson is inviting friends and supporters, as well as new and future industry partners, to learn about its activities, participate in the guidance of its curriculum, and provide input to develop its lab, research, and service capabilities.
The morning will offer a mix of presentations from the:
• Sonoco Institute of Packaging Design and Graphics
• Center for Optical Materials Science and Engineering Technologies (COMSET)
• The Department of Graphic Communications
• The Packaging Science Department
In the afternoon, working breakout groups will concentrate on lab facilities, research and development structure, curriculum, and careers. Industry guests are offered the opportunity to provide advice, make recommendations, and interact with Clemson faculty and advisors to shape the Printed Electronics Applications and Research initiatives.
As an added bonus, the Clemson Tigers will host Wake Forest in a classic ACC match-up Tuesday night, Jan. 22. Please inquire if you are interested in attending.
To learn more about the event, register to attend, request more information, or learn more about the Sonoco Institute, COMSET, Packaging Science, and Graphic Communications visit http://www.clemson.edu/sonoco_institute/ or e-mail sonoco_institute@clemson.edu
On Jan. 23, Clemson is inviting friends and supporters, as well as new and future industry partners, to learn about its activities, participate in the guidance of its curriculum, and provide input to develop its lab, research, and service capabilities.
The morning will offer a mix of presentations from the:
• Sonoco Institute of Packaging Design and Graphics
• Center for Optical Materials Science and Engineering Technologies (COMSET)
• The Department of Graphic Communications
• The Packaging Science Department
In the afternoon, working breakout groups will concentrate on lab facilities, research and development structure, curriculum, and careers. Industry guests are offered the opportunity to provide advice, make recommendations, and interact with Clemson faculty and advisors to shape the Printed Electronics Applications and Research initiatives.
As an added bonus, the Clemson Tigers will host Wake Forest in a classic ACC match-up Tuesday night, Jan. 22. Please inquire if you are interested in attending.
To learn more about the event, register to attend, request more information, or learn more about the Sonoco Institute, COMSET, Packaging Science, and Graphic Communications visit http://www.clemson.edu/sonoco_institute/ or e-mail sonoco_institute@clemson.edu
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