Heidelberg Hosts Successful Packaging Days
April 3, 2009
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KENNESAW, Ga.—A contingent of U.S. customers were among the more than 100 visitors from 25 countries who attended Heidelberg’s Packaging Days, held March 19-20 at the company’s Wiesloch-Walldorf production site in Germany. Customers spent the day reviewing the full range of Heidelberg packaging solutions from prepress to postpress, representing an area the company views as a key strategic growth investment today and for the future.
“The group’s excitement was palpable as customers began to envision new opportunities for their businesses, based on the products we were showing,” said Clarence Penge, vice president, Sheetfed Product Management, Heidelberg. “From our game-changing family of Speedmaster XL sheetfed presses to our diecutters and folding carton gluers to our Heidelberg Integrated Packaging Workflow, visitors were able kick the tires on a whole range of solutions designed to help their businesses prosper.”
“It was nothing less than an awakening,” said Ward McLaughlin, president and CEO of Boutwell, Owens & Co., Inc., Fitchburg, Mass., “All of us had an opportunity to view the technology and speak with the Heidelberg experts, and we also visited nearby printing plants to see the technology in application. With Heidelberg, it’s not just lip service. The company absolutely can prove what it says. When all our questions were answered, we were left with a strong vision of what is—and what can be. Heidelberg definitely has made a serious commitment to the packaging market.”
“The visit was well worth while to see how and where Heidelberg has advanced in the packaging arena,” said Bill Lorenze, vice president of Manufacturing for Jay Packaging, Warwick, R.I. “It was awe-inspiring to see such a spectacular assortment of solutions assembled in one place, and to see and talk with people from around the world. It certainly proved that Heidelberg is committed to the packaging market for the long haul.”
In order to justify its customers’ faith in Heidelberg’s expanded packaging portfolio, the company recently announced that it would centralize and consolidate its packaging R&D in Hall 11 at the Wiesloch-Walldorf facility, including production and assembly of all Dymatrix diecutters. The company has also established a Packaging Competence Center in Hall 11 in Wiesloch-Walldorf for presentations, training and customer application testing.
“The group’s excitement was palpable as customers began to envision new opportunities for their businesses, based on the products we were showing,” said Clarence Penge, vice president, Sheetfed Product Management, Heidelberg. “From our game-changing family of Speedmaster XL sheetfed presses to our diecutters and folding carton gluers to our Heidelberg Integrated Packaging Workflow, visitors were able kick the tires on a whole range of solutions designed to help their businesses prosper.”
“It was nothing less than an awakening,” said Ward McLaughlin, president and CEO of Boutwell, Owens & Co., Inc., Fitchburg, Mass., “All of us had an opportunity to view the technology and speak with the Heidelberg experts, and we also visited nearby printing plants to see the technology in application. With Heidelberg, it’s not just lip service. The company absolutely can prove what it says. When all our questions were answered, we were left with a strong vision of what is—and what can be. Heidelberg definitely has made a serious commitment to the packaging market.”
“The visit was well worth while to see how and where Heidelberg has advanced in the packaging arena,” said Bill Lorenze, vice president of Manufacturing for Jay Packaging, Warwick, R.I. “It was awe-inspiring to see such a spectacular assortment of solutions assembled in one place, and to see and talk with people from around the world. It certainly proved that Heidelberg is committed to the packaging market for the long haul.”
In order to justify its customers’ faith in Heidelberg’s expanded packaging portfolio, the company recently announced that it would centralize and consolidate its packaging R&D in Hall 11 at the Wiesloch-Walldorf facility, including production and assembly of all Dymatrix diecutters. The company has also established a Packaging Competence Center in Hall 11 in Wiesloch-Walldorf for presentations, training and customer application testing.
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