IADD/FSEA 2007 Odyssey Close to Exhibit Sell-out
November 2006
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IADD/FSEA 2007 Odyssey Close to Exhibit Sell-out
The International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA) are excited to report a record-breaking number of exhibitors registered for the 2007 IADD/FSEA Odyssey, May 2-4, 2007, at the Midwest Airlines Center in Milwaukee, Wisconsin, USA. “Currently, we are at 90% of exhibit capacity – far surpassing our numbers from the 2005 Odyssey held in Atlanta,” exclaimed IADD Chief Executive Officer Cindy Crouse. “This is a testament to the increasing value the Odyssey continues to provide to both exhibitors and attendees alike.”
From machinery and supplies to raw materials and services, the three-day trade exposition is targeted specifically to the diecutting/diemaking, foil stamping/embossing, folding carton, and corrugated markets. “And, with the Binding Industries Association (BIA) recently coming on board as an affiliate sponsor, we have expanded our scope to reach trade binderies and commercial printers with bindery operations,” added Crouse.
“On both the diecutting/diemaking and foil stamping/embossing sides, nearly every major supplier of equipment, materials, hot stamping foils, and engravings will be represented at the 2007 Odyssey,” stated FSEA Executive Director Jeff Peterson. “This is an accomplishment no other trade show in 2006 or 2007 can boast!” The Odyssey’s industry-specific trade exposition, coupled with three days of cutting-edge educational Techshop™ and classroom sessions (including a fully operational die shop), creates a powerful venue too valuable to miss!
For further details on exhibiting at the 2007 IADD/FSEA Odyssey, updates on Odyssey programming, or room accommodations, visit www.iadd.org/odyssey or contact the IADD directly at 1-800-828-IADD, 1-815- 455-7519 or the FSEA at 1-785-271-5816. Imagine the Odyssey - a place where solutions become reality!
The International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA) are excited to report a record-breaking number of exhibitors registered for the 2007 IADD/FSEA Odyssey, May 2-4, 2007, at the Midwest Airlines Center in Milwaukee, Wisconsin, USA. “Currently, we are at 90% of exhibit capacity – far surpassing our numbers from the 2005 Odyssey held in Atlanta,” exclaimed IADD Chief Executive Officer Cindy Crouse. “This is a testament to the increasing value the Odyssey continues to provide to both exhibitors and attendees alike.”
From machinery and supplies to raw materials and services, the three-day trade exposition is targeted specifically to the diecutting/diemaking, foil stamping/embossing, folding carton, and corrugated markets. “And, with the Binding Industries Association (BIA) recently coming on board as an affiliate sponsor, we have expanded our scope to reach trade binderies and commercial printers with bindery operations,” added Crouse.
“On both the diecutting/diemaking and foil stamping/embossing sides, nearly every major supplier of equipment, materials, hot stamping foils, and engravings will be represented at the 2007 Odyssey,” stated FSEA Executive Director Jeff Peterson. “This is an accomplishment no other trade show in 2006 or 2007 can boast!” The Odyssey’s industry-specific trade exposition, coupled with three days of cutting-edge educational Techshop™ and classroom sessions (including a fully operational die shop), creates a powerful venue too valuable to miss!
For further details on exhibiting at the 2007 IADD/FSEA Odyssey, updates on Odyssey programming, or room accommodations, visit www.iadd.org/odyssey or contact the IADD directly at 1-800-828-IADD, 1-815- 455-7519 or the FSEA at 1-785-271-5816. Imagine the Odyssey - a place where solutions become reality!
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