Parelec to Sponsor Manufacturing RFID Masterclass at RFID Smart Labels 2007
January 2007
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ROCKY HILL, N.J.—Parelec Inc., a global leader in inks for fully additive printing of electronic circuits, is partnering with IDTechEx to host a Manufacturing RFID masterclass February 20-23 at RFID Smart Labels 2007 in Boston, Mass.
This unique event, hosted by IDTechEx and Parelec, two of the leading companies in the field will include speakers from each segment of the value chain covering the options and topics that manufacturers need to know about. The masterclass will be interactive and hands on, with delegates being able to handle many different RFID samples at each stage of the value chain. Delegates will learn of opportunities in this sector, answers to their questions on manufacturing RFID, and the full range of options available, all analyzed and explained for them by leading experts. They will also take away free access to the monthly IDTechEx journal “RFID analyst” to stay updated for the months ahead with global progress.
“We see this event as yet another opportunity to educate the market about RFID technologies and processes, an effort we are actively engaged in through our Certified Partner Program,” notes Geva Barash, President and CEO of Parelec. Companies speaking at the masterclass include NXP, RSI, Coveme, and other leaders in the field of RFID. Each is an active member of Parelec’s Certified Partner Program. This program brings together the market’s top providers to deliver the best performance in low cost solution RFID.
The Manufacturing RFID masterclass precedes the two-day RFID Smart Labels USA conference that begins the following morning. For the past six years, this large-scale industry event has brought together international RFID vendors and customers in one venue, providing education and networking opportunities.
The masterclass is aimed at converters, packagers, labelers, printers, label suppliers, specifiers, buyers, and brand owners. It will explain the full value chain of manufacturing RFID smart labels from design to finished product. Topics include evaluation of manufacturing methods, chip attachment processes, antenna technologies, overprinting and insertion, specifying RFID labels, managing data, and best practice. Delegates will be able to handle many different samples. The session will address: understanding the tag production value chain and entry points; evaluation of the choices for manufacturing complete RFID labels, tickets and cards; how things are made and what they cost; manufacturing RFID tag antennas: technologies, performance, and cost; substrates, inks, and adhesives —suppliers, costs, and performance; chip attach options; analysis of routes to high volume manufacture; oversupply and undersupply; applying RFID to products: required throughput, testing, and finish; major players, emerging players, and unsatisfied needs i.e. opportunities; and current industry manufacturing capacity and future needs. For more information on the masterclass and to register, visit www.idtechex.com/usa
This unique event, hosted by IDTechEx and Parelec, two of the leading companies in the field will include speakers from each segment of the value chain covering the options and topics that manufacturers need to know about. The masterclass will be interactive and hands on, with delegates being able to handle many different RFID samples at each stage of the value chain. Delegates will learn of opportunities in this sector, answers to their questions on manufacturing RFID, and the full range of options available, all analyzed and explained for them by leading experts. They will also take away free access to the monthly IDTechEx journal “RFID analyst” to stay updated for the months ahead with global progress.
“We see this event as yet another opportunity to educate the market about RFID technologies and processes, an effort we are actively engaged in through our Certified Partner Program,” notes Geva Barash, President and CEO of Parelec. Companies speaking at the masterclass include NXP, RSI, Coveme, and other leaders in the field of RFID. Each is an active member of Parelec’s Certified Partner Program. This program brings together the market’s top providers to deliver the best performance in low cost solution RFID.
The Manufacturing RFID masterclass precedes the two-day RFID Smart Labels USA conference that begins the following morning. For the past six years, this large-scale industry event has brought together international RFID vendors and customers in one venue, providing education and networking opportunities.
The masterclass is aimed at converters, packagers, labelers, printers, label suppliers, specifiers, buyers, and brand owners. It will explain the full value chain of manufacturing RFID smart labels from design to finished product. Topics include evaluation of manufacturing methods, chip attachment processes, antenna technologies, overprinting and insertion, specifying RFID labels, managing data, and best practice. Delegates will be able to handle many different samples. The session will address: understanding the tag production value chain and entry points; evaluation of the choices for manufacturing complete RFID labels, tickets and cards; how things are made and what they cost; manufacturing RFID tag antennas: technologies, performance, and cost; substrates, inks, and adhesives —suppliers, costs, and performance; chip attach options; analysis of routes to high volume manufacture; oversupply and undersupply; applying RFID to products: required throughput, testing, and finish; major players, emerging players, and unsatisfied needs i.e. opportunities; and current industry manufacturing capacity and future needs. For more information on the masterclass and to register, visit www.idtechex.com/usa
Companies Mentioned:
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